Invention Grant
- Patent Title: Test system and method for wafer including optical component
- Patent Title (中): 包括光学元件的晶片测试系统和方法
-
Application No.: US14159828Application Date: 2014-01-21
-
Publication No.: US09297849B2Publication Date: 2016-03-29
- Inventor: Dong Jae Shin , Yoon Dong Park , Sang Hun Choi , Kyoung Ho Ha
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2013-0008306 20130124
- Main IPC: G02B6/30
- IPC: G02B6/30 ; G01R31/26

Abstract:
A wafer test system includes an input device configured to transmit a test signal, a wafer including an optical port, an input port configured to receive the test signal, and an output port configured to output a result signal based on the test signal, a measuring device configured to measure the result signal, and an alignment device configured to align an optical fiber port of an optical probe with an alignment port based on the result signal and then align the optical fiber port with the optical port. The alignment port is the input port or the output port. The optical probe is configured to be the input device when the input port is the alignment port and the optical probe is configured to be the measuring device when the output port is the alignment port.
Public/Granted literature
- US20140203830A1 TEST SYSTEM AND METHOD FOR WAFER INCLUDING OPTICAL COMPONENT Public/Granted day:2014-07-24
Information query