发明授权
- 专利标题: Planarized three-dimensional (3D) magnetic sensor chip
- 专利标题(中): 平面化三维(3D)磁传感器芯片
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申请号: US13834426申请日: 2013-03-15
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公开(公告)号: US09297863B2公开(公告)日: 2016-03-29
- 发明人: Jen-Tzong Jeng , Fu-Te Yuan , Meng-Huang Lai
- 申请人: Meng-Huang Lai
- 申请人地址: TW New Taipei
- 专利权人: Meng-Huang Lai
- 当前专利权人: Meng-Huang Lai
- 当前专利权人地址: TW New Taipei
- 代理机构: Lin & Associates Intellectual Property, Inc.
- 主分类号: G01R33/00
- IPC分类号: G01R33/00 ; G01R33/02 ; G01R33/09
摘要:
A planarized 3-dimensional magnetic sensor chip includes a first magnetic sensing device, a second magnetic sensing device, a third magnetic sensing device and a magnetic flux bending concentrating structure on a circuit chip substrate, wherein the first magnetic sensing device and the second magnetic sensing device are used to measure the magnitude of flux in a first direction and a third direction together, and the third magnetic sensing device is used to measure the magnitude of flux in a second direction, the magnetic flux bending concentrating structure is used to bend the magnitude of flux in the third direction to the first direction, such that the magnitude of flux in the third direction can be measured by first magnetic sensing device and the second magnetic sensing device in the first direction.
公开/授权文献
- US20140266184A1 PLANARIZED THREE-DIMENSIONAL (3D) MAGNETIC SENSOR CHIP 公开/授权日:2014-09-18
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