Invention Grant
US09299641B2 Semiconductor system, device and structure with heat removal 有权
半导体系统,器件和结构与散热

Semiconductor system, device and structure with heat removal
Abstract:
A 3D device including: a first layer including first transistors, the first layer overlaid by at least one interconnection layer; a second layer including second transistors, the second layer overlaying the interconnection layer; a plurality of electrical connections connecting the second transistors with the interconnection layer; and at least one thermally conductive and electrically non-conductive contact, where the at least one thermally conductive and electrically non-conductive contact thermally connects the second layer to a top or bottom surface of the 3D device.
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