Invention Grant
- Patent Title: Semiconductor system, device and structure with heat removal
- Patent Title (中): 半导体系统,器件和结构与散热
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Application No.: US14747599Application Date: 2015-06-23
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Publication No.: US09299641B2Publication Date: 2016-03-29
- Inventor: Deepak Sekar , Zvi Or-Bach , Brian Cronquist
- Applicant: Monolithic 3D Inc.
- Applicant Address: US CA San Jose
- Assignee: MONOLITHIC 3D INC.
- Current Assignee: MONOLITHIC 3D INC.
- Current Assignee Address: US CA San Jose
- Agency: Tran & Associates
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L27/088 ; H01L23/367 ; H01L23/522 ; H01L27/06

Abstract:
A 3D device including: a first layer including first transistors, the first layer overlaid by at least one interconnection layer; a second layer including second transistors, the second layer overlaying the interconnection layer; a plurality of electrical connections connecting the second transistors with the interconnection layer; and at least one thermally conductive and electrically non-conductive contact, where the at least one thermally conductive and electrically non-conductive contact thermally connects the second layer to a top or bottom surface of the 3D device.
Public/Granted literature
- US20150311142A1 SEMICONDUCTOR SYSTEM, DEVICE AND STRUCTURE WITH HEAT REMOVAL Public/Granted day:2015-10-29
Information query
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