发明授权
- 专利标题： Semiconductor device having lead frame with notched inner leads
- 专利标题（中）： 半导体器件具有带有缺口内引线的引线框架
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申请号： US14551075申请日： 2014-11-23
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公开(公告)号： US09299645B2公开(公告)日： 2016-03-29
- 发明人: Lei Wang , Liping Guo , Jinsheng Wang
- 申请人： Lei Wang , Liping Guo , Jinsheng Wang
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Charles E. Bergere
- 优先权： CN201410191981 20140331
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00 ; H01L23/31
摘要：
A semiconductor device is assembled from a lead frame. The device has a semiconductor die mounted on a flag of the lead frame. A mold compound forms a housing that covers the die. Lead fingers surround the die. Each lead finger has an inner lead length that is covered by the housing and an outer lead length that protrudes from the housing. The inner lead length extends from an edge of the housing towards the die. The inner lead length has an intermediate region that has been bent to form a notch. Bond wires electrically connect electrodes of the die to respective inner lead lengths.
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