Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US14662194Application Date: 2015-03-18
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Publication No.: US09299714B2Publication Date: 2016-03-29
- Inventor: Moon-Sik Seo , Tetsuo Endoh
- Applicant: SK hynix Inc. , Tohoku University
- Applicant Address: KR Icheon JP Sendai
- Assignee: SK HYNIX INC.,TOHOKU UNIVERSITY
- Current Assignee: SK HYNIX INC.,TOHOKU UNIVERSITY
- Current Assignee Address: KR Icheon JP Sendai
- Priority: JP2012-246969 20121109
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/66 ; H01L29/788

Abstract:
A semiconductor device includes a channel layer protruding from a substrate and having protrusions extending from a sidewall thereof. Floating gates surrounding the channel layer are provided between the protrusions. Control gates surrounding the floating gates are stacked along the channel layer. Interlayer insulating layers are interposed between the control gates stacked along the channel layer. A level difference exists between a lateral surface of each of the floating gates, and a lateral surface of each of the protrusions.
Public/Granted literature
- US20150194437A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-07-09
Information query
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