Invention Grant
- Patent Title: Manufacturing method of low temperature polysilicon, low temperature polysilicon film and thin film transistor
- Patent Title (中): 低温多晶硅,低温多晶硅薄膜和薄膜晶体管的制造方法
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Application No.: US14349583Application Date: 2013-10-22
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Publication No.: US09299808B2Publication Date: 2016-03-29
- Inventor: Xueyan Tian
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201310139120 20130419
- International Application: PCT/CN2013/085683 WO 20131022
- International Announcement: WO2014/169601 WO 20141023
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L21/268 ; H01L29/786 ; H01L27/12 ; H01L21/324 ; H01L27/32 ; H01L29/04

Abstract:
A method of manufacturing low temperature polysilicon is provided, comprising: depositing a buffer layer (20) on a base substrate (10); depositing an amorphous silicon layer (30) on the buffer layer; performing a heat treatment after forming the amorphous silicon layer; and dividing the amorphous silicon layer into a plurality of areas for laser annealing according to a thickness distribution of the amorphous silicon layer to form a polycrystalline silicon layer. A low temperature polysilicon film manufactured by the low temperature polysilicon manufacturing method and a thin film transistor having the film are also provided. The method realizes large grain size for polysilicons in each area of the amorphous silicon layer and a uniform distribution of polysilicon grain size across the entire substrate.
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