Invention Grant
- Patent Title: Physical-layer channel bonding
- Patent Title (中): 物理层通道结合
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Application No.: US13875990Application Date: 2013-05-02
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Publication No.: US09300404B2Publication Date: 2016-03-29
- Inventor: Stephen J. Shellhammer , Patrick Stupar , Nicola Varanese , Andrea Garavaglia , Juan Montojo , Christian Pietsch
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Mahamedi Paradice LLP
- Main IPC: H04B10/27
- IPC: H04B10/27 ; H04Q11/00

Abstract:
A network device includes a plurality of physical-media entities (PMEs), each corresponding to a distinct channel, to generate transmit signals based on transmit packets received over a media-independent interface. The network device also includes a channel-bonding sublayer to direct the transmit packets from the media-independent interface to respective PMEs of the plurality of PMEs. The channel-bonding sublayer has a substantially fixed delay between the media-independent interface and the plurality of PMEs for the transmit packets.
Public/Granted literature
- US20140186041A1 PHYSICAL-LAYER CHANNEL BONDING Public/Granted day:2014-07-03
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