Invention Grant
- Patent Title: Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit
- Patent Title (中): 用于电流变流体微通道冷却集成电路的自动补偿温度阀控制器
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Application No.: US14882658Application Date: 2015-10-14
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Publication No.: US09301424B2Publication Date: 2016-03-29
- Inventor: Kerry Bernstein , Kenneth J. Goodnow , Clarence R. Ogilvie , John Sargis, Jr. , Sebastian T. Ventrone , Charles S. Woodruff
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Schmeiser, Olsen & Watts
- Agent Steven Meyers
- Main IPC: H01L35/00
- IPC: H01L35/00 ; H05K7/20 ; H01L23/473

Abstract:
A structure and method of using the structure. The structure including an integrated circuit chip having a set of micro-channels; an electro-rheological coolant fluid filling the micro-channels; first and second parallel channel electrodes on opposite sides of at least one micro-channel, the first channel electrode connected to an output of an auto-compensating temperature control circuit, the second channel electrode connected to ground; the auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and the output and having a temperature sensitive circuit connected between ground and the output, a leakage current of the temperature stable current source being essentially insensitive to temperature and a leakage current of the temperature sensitive circuit increasing with temperature.
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