Invention Grant
- Patent Title: Cutting tools for cutting curved and complex features
- Patent Title (中): 用于切割弯曲和复杂特征的切割工具
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Application No.: US13840335Application Date: 2013-03-15
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Publication No.: US09302334B2Publication Date: 2016-04-05
- Inventor: Napthaneal Y. Tan , Chien-Ming Huang , Yu Yundi , Zhoujun Lu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Downey Brand LLP
- Main IPC: B23C5/12
- IPC: B23C5/12 ; B23C5/10 ; B23C3/12 ; B23C5/18 ; C25D11/12 ; H04M1/02 ; C25D11/18

Abstract:
The embodiments described herein relate to methods, systems, and structures for cutting a part to form a highly reflective and smooth surface. In some embodiments, the part includes substantially horizontal and vertical surfaces with edges and corners. In described embodiments, a diamond cutter can be used to cut a surface of the part during a milling operation where the diamond cutter contacts the part a number of times with each rotation of the spindle of a milling machine. In some embodiments, a complex feature having planar and curved surfaces is cut into a part.
Public/Granted literature
- US20140069245A1 CUTTING TOOLS FOR CUTTING CURVED AND COMPLEX FEATURES Public/Granted day:2014-03-13
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