Invention Grant
US09303149B2 Adhesion promoting adducts containing metal ligands, compositions thereof, and uses thereof
有权
含金属配体的粘合促进加合物及其组合物及其用途
- Patent Title: Adhesion promoting adducts containing metal ligands, compositions thereof, and uses thereof
- Patent Title (中): 含金属配体的粘合促进加合物及其组合物及其用途
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Application No.: US14065521Application Date: 2013-10-29
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Publication No.: US09303149B2Publication Date: 2016-04-05
- Inventor: Chandra Rao , Jun Deng , Renhe Lin
- Applicant: PRC-DeSoto International, Inc.
- Applicant Address: US CA Sylmar
- Assignee: PRC-DeSoto International, Inc.
- Current Assignee: PRC-DeSoto International, Inc.
- Current Assignee Address: US CA Sylmar
- Agent William R. Lambert
- Main IPC: C08K5/548
- IPC: C08K5/548 ; C08K5/544 ; C08G75/02 ; C09J181/02 ; C08L81/02
Abstract:
Disclosed are adhesion promoting adducts containing adhesion promoting groups and metal ligands and compositions such as sealant compositions useful in aerospace applications comprising the adhesion promoting adducts. The adhesion promoting adducts are useful as adhesion promoting additives or as a copolymerizable reactant in polymer compositions.
Public/Granted literature
- US20140051789A1 ADHESION PROMOTING ADDUCTS CONTAINING METAL LIGANDS, COMPOSITIONS THEREOF, AND USES THEREOF Public/Granted day:2014-02-20
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