A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component disposed on the component carrier and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.