An interposer sub-assembly for holding or gripping a plurality of optical fibers in a multi-fiber ferrule connector including: a substrate comprising a bottom surface, a top surface, and a front face; a pair of guide pin grooves on the bottom surface of said substrate, wherein the pair of guide pin grooves are capable of receiving guide pins from a ferrule connector; and a plurality of resilient fiber grooves formed on the bottom surface, wherein the plurality of resilient fiber grooves are configured for receiving a plurality of optical conduits.