Invention Grant
- Patent Title: High-voltage conductive path and wiring harness
- Patent Title (中): 高压导电路径和线束
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Application No.: US13980828Application Date: 2012-01-20
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Publication No.: US09305681B2Publication Date: 2016-04-05
- Inventor: Eiichi Toyama , Tatsuya Oga , Shigemi Hashizawa , Eiji Shimochi
- Applicant: Eiichi Toyama , Tatsuya Oga , Shigemi Hashizawa , Eiji Shimochi
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2011-010419 20110121
- International Application: PCT/JP2012/000344 WO 20120120
- International Announcement: WO2012/098906 WO 20120726
- Main IPC: H01B3/00
- IPC: H01B3/00 ; H01B9/00 ; H01B9/04 ; H01B7/00

Abstract:
A wiring harness including a high-voltage conductive path having a shape holding function for holding a shape along an arrangement pathway. The high-voltage conductive path includes a positive electrode conductor, a first insulator extruded and arranged outside of the positive electrode conductor, a negative electrode arranged outside of the first insulator, a second insulator extruded and arranged outside of the negative electrode conductor, a shield member wrapped outside of the second insulator, first and second sheaths extruded and arranged outside of the shield member.
Public/Granted literature
- US20140014395A1 HIGH-VOLTAGE CONDUCTIVE PATH AND WIRING HARNESS Public/Granted day:2014-01-16
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