发明授权
- 专利标题： Die eject assembly for die bonder
- 专利标题（中）： 模具焊接机的模具出口组件
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申请号： US13794387申请日： 2013-03-11
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公开(公告)号： US09305812B2公开(公告)日： 2016-04-05
- 发明人: Ali Imran Amin , Hamdan Hamid
- 申请人： Texas Instruments Incorporated
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 代理商 Steven A. Shaw; Frank D. Cimino
- 主分类号： B32B38/10
- IPC分类号： B32B38/10 ; H01L21/67 ; H01L21/683 ; H01L21/687
摘要：
Disclosed herein is a die eject assembly for a die bonder that may include a poker pin having an elongate shaft portion with a first end and a second end. The poker pin further includes a base portion having a first end and a second end. The base portion has a maximum diameter that is larger than the maximum diameter of the elongate shaft portion. The elongate shaft portion first end is fixedly attached to the base portion second end.
公开/授权文献
- US20140251760A1 DIE EJECT ASSEMBLY FOR DIE BONDER 公开/授权日：2014-09-11
信息查询
