Invention Grant
- Patent Title: Semiconductor substrate for photonic and electronic structures and method of manufacture
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Application No.: US14698091Application Date: 2015-04-28
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Publication No.: US09305826B2Publication Date: 2016-04-05
- Inventor: Roy Meade , Gurtej Sandhu
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L29/00 ; H01L21/762 ; G02B6/136 ; H01L27/146 ; H01L29/06 ; G02B6/122 ; H01L27/092 ; G02B6/13 ; H01L21/308 ; G02B6/12

Abstract:
A method of forming a substrate with isolation areas suitable for integration of electronic and photonic devices is provided. A common reticle and photolithographic technique is used to fabricate a mask defining openings for etching first and second trench isolation areas in a substrate, with the openings for the second trench isolation areas being wider than the openings for the first trench isolation areas. The first and second trench isolation areas are etched in the substrate through the mask. The second trench isolation areas are further etched to the deeper than the first trench isolation areas. The trench isolation areas are filled with oxide material. Electrical devices can be formed on the substrate and electrically isolated by the first trench isolation areas and photonic devices can be formed over the second trench isolation areas and be optically isolated from the substrate.
Public/Granted literature
- US20150243546A1 SEMICONDUCTOR SUBSTRATE FOR PHOTONIC AND ELECTRONIC STRUCTURES AND METHOD OF MANUFACTURE Public/Granted day:2015-08-27
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