Invention Grant
- Patent Title: Constrained die adhesion cure process
- Patent Title (中): 约束模具粘附固化过程
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Application No.: US13910152Application Date: 2013-06-05
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Publication No.: US09305894B2Publication Date: 2016-04-05
- Inventor: Edmund Blackshear , Vijayeshwar D. Khanna , Oswald J. Mantilla
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Heslin Rothenberg Farley & Mesiti P.C.
- Agent George Blasiak
- Main IPC: H01L23/00
- IPC: H01L23/00

Abstract:
A clamping apparatus applies a force to a workpiece during processing. The clamping apparatus includes a base defining a work area configured to receive a joined structure having multiple elements. The base defines a recess in the work area. An adjustable mechanism is configured to releasably couple to the base and apply a adjustable downward force to the joined structure to bend the joined structure downwardly into the recess during a process. A resilient plunger is part of the adjustable mechanism. The resilient plunger extends downwardly from a top plate of the adjustable mechanism, and the resilient plunger is configured to contact a top of a first element of the joined structure to apply the downward force.
Public/Granted literature
- US20140359995A1 CONSTRAINED DIE ADHESION CURE PROCESS Public/Granted day:2014-12-11
Information query
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