Invention Grant
- Patent Title: Composite electronic component
- Patent Title (中): 复合电子元件
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Application No.: US13759402Application Date: 2013-02-05
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Publication No.: US09306538B2Publication Date: 2016-04-05
- Inventor: Kanehisa Kimbara , Osamu Kawachi
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2012-111936 20120515
- Main IPC: H01L41/00
- IPC: H01L41/00 ; H03H9/46 ; H03H9/70 ; H03H9/05 ; H05K1/02 ; H05K1/18 ; H05K1/11
Abstract:
A composite electronic component includes: a circuit board; a package that includes an acoustic wave filter and is located on a top surface of the circuit board; a dummy package that is located on the top surface of the circuit board; and a lid that is located above the package and the dummy package.
Public/Granted literature
- US20130307636A1 COMPOSITE ELECTRONIC COMPONENT Public/Granted day:2013-11-21
Information query
IPC分类:
