The present invention provides a metallized via-holed ceramic substrate having (1) a sintered ceramic substrate, (2) an electroconductive via formed in the sintered ceramic substrate, having an electroconductive metal closely filled in a through-hole of the sintered ceramic substrate, wherein the electroconductive metal contains a metal (A) with melting point of 600° C. to 1100° C., a metal (B) with higher melting point than the metal (A), and an active metal, (3) a wiring pattern on at least one face of the sintered ceramics substrate, having an electroconductive surface layer and a plating layer thereon, wherein the electroconductive surface layer consists of an electroconductive metal containing the metal (A), the metal (B), and an active metal, (4) an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate, and (5) an active layer formed in the interface between the electroconductive surface layer and the sintered ceramic substrate.