Invention Grant
- Patent Title: Low thermal resistance cooler module for embedded system
- Patent Title (中): 用于嵌入式系统的低热阻冷却器模块
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Application No.: US13733597Application Date: 2013-01-03
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Publication No.: US09307678B2Publication Date: 2016-04-05
- Inventor: Li-Jie Yu
- Applicant: ADLINK TECHNOLOGY INC.
- Applicant Address: TW New Taipei
- Assignee: ADLINK TECHNOLOGY INC
- Current Assignee: ADLINK TECHNOLOGY INC
- Current Assignee Address: TW New Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02 ; H01L23/427 ; G06F1/20

Abstract:
A low thermal resistance cooler module includes a heat-transfer base member defining a recess and multiple elongated, curved locating grooves, flat heat pipes set in the elongated, curved locating grooves with respective hot interfaces thereof suspending in the recess and respective cold interfaces thereof bonded to the heat-transfer base member, a heat-transfer block fixedly mounted with the hot interfaces of the flat heat pipes in the recess of the heat-transfer base member for transferring waste heat from a heat source of an external circuit board by direct contact, and connection plates respectively connected between the heat-transfer block and the heat-transfer base member.
Public/Granted literature
- US20140182817A1 LOW THERMAL RESISTANCE COOLER MODULE FOR EMBEDDED SYSTEM Public/Granted day:2014-07-03
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