Invention Grant
- Patent Title: Solder, solder joint structure and method of forming solder joint structure
- Patent Title (中): 焊接，焊点结构及形成焊点结构的方法
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Application No.: US13855719Application Date: 2013-04-03
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Publication No.: US09308603B2Publication Date: 2016-04-12
- Inventor: Kuo-Shu Kao , Tao-Chih Chang , Wen-Chih Chen
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW101142671A 20121115
- Main IPC: B32B15/20
- IPC: B32B15/20 ; B23K35/24 ; B32B15/01 ; B23K35/28 ; B23K35/30 ; H01L23/495 ; H01L23/00 ; H01L23/373 ; H01L25/065
Abstract:
A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material.
Public/Granted literature
- US20140134459A1 SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT STRUCTURE Public/Granted day:2014-05-15
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