发明授权
- 专利标题： Multilayer electronic structure with novel transmission lines
- 专利标题（中）： 传输线新颖多层电子结构
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申请号： US13483234申请日： 2012-05-30
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公开(公告)号： US09312593B2公开(公告)日： 2016-04-12
- 发明人: Dror Hurwitz
- 申请人： Dror Hurwitz
- 申请人地址： CN Zhuhai
- 专利权人： Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- 当前专利权人： Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- 当前专利权人地址： CN Zhuhai
- 代理机构： Wiggin and Dana LLP
- 代理商 Gregory S. Rosenblatt; Jonathan D. Hall
- 主分类号： H01P11/00
- IPC分类号： H01P11/00 ; H01P3/08 ; H05K1/02 ; H05K3/46
摘要：
A signal carrier for carrying a signal in a direction within the X-Y plane of a multilayer composite electronic structure comprising a plurality of dielectric layers extending in an X-Y plane, the signal carrier comprising a first transmission line comprising a lower continuous metallic layer and further comprising a row of metallic via posts coupled to the continuous metal layer, wherein the transmission line is separated by a dielectric material from an underlying reference plane.
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