Invention Grant
- Patent Title: Non-contact IC label and nameplate
- Patent Title (中): 非接触式IC标签和铭牌
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Application No.: US13817034Application Date: 2011-08-12
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Publication No.: US09317800B2Publication Date: 2016-04-19
- Inventor: Kunio Omura , Hidemi Nakajima
- Applicant: Kunio Omura , Hidemi Nakajima
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2010-181616 20100816; JP2010-229797 20101012; JP2011-119293 20110527; JP2011-119294 20110527
- International Application: PCT/JP2011/068432 WO 20110812
- International Announcement: WO2012/023511 WO 20120223
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G08B13/14 ; G06K19/077 ; H01Q1/22 ; H01Q9/28 ; H01Q21/24 ; G06K7/10
Abstract:
A non-contact IC label includes a magnetic sheet, an IC chip arranged on the magnetic sheet, a first antenna portion including a first connection portion connected to the IC chip and arranged on the magnetic sheet to extend in a first direction from the first connection portion, and a second antenna portion including a second connection portion connected to the IC chip and arranged on the magnetic sheet to extend in a second direction from the second connection portion, wherein each of the first direction and the second direction is along one side of the magnetic sheet, the first direction and the second direction differ from each other, and each of a length of the first antenna portion in a direction perpendicular to the first direction and a length of the second antenna portion in a direction perpendicular to the second direction ranges from 2 mm to 15 mm.
Public/Granted literature
- US20130140371A1 NON-CONTACT IC LABEL AND NAMEPLATE Public/Granted day:2013-06-06
Information query
