Invention Grant
- Patent Title: Power module package and method for manufacturing the same
- Patent Title (中): 电源模块封装及其制造方法
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Application No.: US13973644Application Date: 2013-08-22
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Publication No.: US09318352B2Publication Date: 2016-04-19
- Inventor: Kwang Soo Kim , Young Ki Lee , Seog Moon Choi , Jin Suk Son
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: Ladas & Parry, LLP
- Priority: KR1020110072105 20110720
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L25/07 ; H01L21/50 ; H01L23/433 ; H01L23/24 ; H01L23/31 ; H01L21/56
Abstract:
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.
Public/Granted literature
- US20130337613A1 POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-12-19
Information query
IPC分类:
