Invention Grant
- Patent Title: Chip-on-film package and display device having the same
- Patent Title (中): 片上封装和显示装置具有相同的功能
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Application No.: US14062580Application Date: 2013-10-24
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Publication No.: US09318398B2Publication Date: 2016-04-19
- Inventor: Hee Kwon Lee
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Giheung-Gu, Yongin-si, Gyeonggi-Do
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Giheung-Gu, Yongin-si, Gyeonggi-Do
- Agent Robert E. Bushnell, Esq.
- Priority: KR10-2013-0047538 20130429
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/66 ; H01L27/32
Abstract:
A chip-on-film package includes a base film, a test line, and an integrated circuit chip. The base film includes a bent area in which a bending occurs. The test line is disposed on the base film, and at least a portion of the test line is overlapped with the bent area. The integrated circuit chip is disposed on the base film and includes a first terminal and a second terminal. The first terminal is connected to one end of the test line to output a first signal and the second terminal is connected to the other end of the test line to receive a second signal. The integrated circuit chip detects whether a crack occurs in the bent area based on a difference value in signal characteristics.
Public/Granted literature
- US20140319523A1 CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE HAVING THE SAME Public/Granted day:2014-10-30
Information query
IPC分类:
