Invention Grant
- Patent Title: Integrated circuit packaging system with magnetic film and method of manufacture thereof
- Patent Title (中): 具有磁性膜的集成电路封装系统及其制造方法
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Application No.: US13211303Application Date: 2011-08-16
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Publication No.: US09318403B2Publication Date: 2016-04-19
- Inventor: Sung Soo Kim , DongSik Kim , ChoongHwan Kwon
- Applicant: Sung Soo Kim , DongSik Kim , ChoongHwan Kwon
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/31 ; H01L23/552 ; H01L25/10 ; H01L25/00 ; H01L25/03 ; H01L23/00 ; H01L25/065
Abstract:
An integrated circuit packaging system including: connecting a first integrated circuit device and a package substrate; attaching a support bump to the package substrate; providing a second integrated circuit device having an inner encapsulation; applying a magnetic film on the inner encapsulation of the second integrated circuit device; and mounting the second integrated circuit device over the first integrated circuit device with the magnetic film on the first integrated circuit device and the support bump.
Public/Granted literature
- US20110298106A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MAGNETIC FILM AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-12-08
Information query
IPC分类:
