发明授权
- 专利标题： Semiconductor package with package-on-package stacking capability and method of manufacturing the same
- 专利标题（中）： 具有封装封装堆叠能力的半导体封装及其制造方法
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申请号： US14514360申请日： 2014-10-14
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公开(公告)号： US09318411B2公开(公告)日： 2016-04-19
- 发明人: Charles W. C. Lin , Chia-Chung Wang
- 申请人： BRIDGE SEMICONDUCTOR CORPORATION
- 申请人地址： TW Taipei
- 专利权人： BRODGE SEMICONDUCTOR CORPORATION
- 当前专利权人： BRODGE SEMICONDUCTOR CORPORATION
- 当前专利权人地址： TW Taipei
- 代理机构： Pai Patent & Trademark Law Firm
- 代理商 Chao-Chang David Pai
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/36 ; H01L23/00 ; H01L25/10 ; H01L23/367 ; H01L23/538 ; H01L23/552 ; H01L25/065 ; H01L25/00 ; H01L23/498
摘要：
The present invention relates to a method of making a semiconductor package with package-on-package stacking capability. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a metallic carrier with the chip inserted into a cavity of the metallic carrier, and the step of selectively removing portions of the metallic carrier to define a heat spreader for the chip. The heat spreader can provide thermal dissipation, electromagnetic shielding and moisture barrier, whereas the interposer provides a CTE-matched interface and fan-out routing for the chip.
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