Invention Grant
- Patent Title: Through via package
- Patent Title (中): 通过包装
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Application No.: US14548090Application Date: 2014-11-19
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Publication No.: US09318459B2Publication Date: 2016-04-19
- Inventor: How Yuan Hwang , Kah Wee Gan
- Applicant: STMicroelectronics Pte Ltd
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd.
- Current Assignee: STMicroelectronics Pte Ltd.
- Current Assignee Address: SG Singapore
- Agency: Seed Intellectual Property Law Group PLLC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L23/538 ; H01L23/48 ; H01L23/31
Abstract:
An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side.
Public/Granted literature
- US20150069607A1 THROUGH VIA PACKAGE Public/Granted day:2015-03-12
Information query
IPC分类:
