Invention Grant
- Patent Title: Injection control in semiconductor power devices
- Patent Title (中): 半导体功率器件中的注入控制
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Application No.: US14292692Application Date: 2014-05-30
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Publication No.: US09318587B2Publication Date: 2016-04-19
- Inventor: Madhur Bobde , Jun Hu , Lingpeng Guan , Hamza Yilmaz , Lei Zhang , Jongoh Kim
- Applicant: Alpha and Omega Semiconductor Incorporated
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agency: JDI Patent
- Agent Joshua D. Isenberg
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/36 ; H01L29/10 ; H01L29/06 ; H01L29/74 ; H01L29/66 ; H01L21/265

Abstract:
Semiconductor power devices can be formed on substrate structure having a lightly doped semiconductor substrate of a first conductivity type or a second conductivity type opposite to the first conductivity type. A semiconductive first buffer layer of the first conductivity type formed above the substrate. A doping concentration of the first buffer layer is greater than a doping concentration of the substrate. A second buffer layer of the second conductivity type formed above the first buffer layer. An epitaxial layer of the second conductivity type formed above the second buffer layer. A doping concentration of the epitaxial layer is greater than a doping concentration of the second buffer layer. This abstract is provided to allow a searcher or reader to quickly ascertain the subject matter of the disclosure with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Public/Granted literature
- US20150349101A1 INJECTION CONTROL IN SEMICONDUCTOR POWER DEVICES Public/Granted day:2015-12-03
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