Invention Grant
- Patent Title: Multi-standard headset support with integrated ground switching
- Patent Title (中): 多标准耳机支持集成接地切换
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Application No.: US13312897Application Date: 2011-12-06
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Publication No.: US09319768B2Publication Date: 2016-04-19
- Inventor: Christian Larsen , Lorenzo Crespi , Brian W. Friend
- Applicant: Christian Larsen , Lorenzo Crespi , Brian W. Friend
- Applicant Address: US CA Newport Beach
- Assignee: CONEXANT SYSTEMS, INC.
- Current Assignee: CONEXANT SYSTEMS, INC.
- Current Assignee Address: US CA Newport Beach
- Agency: Haynes and Boone, LLP
- Main IPC: H04R5/033
- IPC: H04R5/033 ; H04R1/10 ; H01R24/58

Abstract:
A system for detecting a jack configuration comprising a first plurality of switches configured to couple a first headphone jack position to ground. A second plurality of switches configured to couple a second headphone jack position to ground. A microphone bias circuit for applying a microphone bias signal to the second headphone jack position when the first headphone jack position is coupled to ground, and for applying the microphone bias signal to the first headphone jack position when the second headphone jack position is coupled to ground.
Public/Granted literature
- US20130142350A1 MULTI-STANDARD HEADSET SUPPORT WITH INTEGRATED GROUND SWITCHING Public/Granted day:2013-06-06
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