Invention Grant
- Patent Title: Wireless headphones
- Patent Title (中): 无线耳机
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Application No.: US14253681Application Date: 2014-04-15
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Publication No.: US09319769B2Publication Date: 2016-04-19
- Inventor: Seth D. Burgett , Effrosini A. Karayiannis , Aaron Gorga
- Applicant: Harman International Industries, Incorporated
- Applicant Address: US CT Stamford
- Assignee: Harman International Industries, Incorporated
- Current Assignee: Harman International Industries, Incorporated
- Current Assignee Address: US CT Stamford
- Agency: Brooks Kushman P.C.
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/033

Abstract:
Wireless headphones include left and right earphones connected by a cable. Each of the left and right earphones comprising a generally C-shaped body adapted to fit behind the user's ear, with a concave inner edge, a convex outer edge, a first end that is positioned generally adjacent the top of the user's ear and a second end positioned generally adjacent the bottom of the user's ear when the body is positioned behind the user's ear. A speaker having a sound tunnel associated therewith adapted to fit in the ear canal of the wearer; a resilient support extending forwardly and downwardly from the top end of the C-shaped body, the support normally supporting the speaker in a position which, when the C-shaped body behind the user's ear, is misaligned with the user's ear canal, but resiliently deflects to allow the sound tunnel to align with and be inserted into the user's ear canal, thereby resiliently biasing the C-shaped body against the user's head.
Public/Granted literature
- US20140307891A1 WIRELESS HEADPHONES Public/Granted day:2014-10-16
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