发明授权
- 专利标题： Printed circuit board and method for manufacturing the same
- 专利标题（中）： 印刷电路板及其制造方法
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申请号： US14125238申请日： 2012-06-11
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公开(公告)号： US09320137B2公开(公告)日： 2016-04-19
- 发明人: Dong Wan Kim , Tae Ho Kim , Il Sang Maeng , Song Hee Cho
- 申请人： Dong Wan Kim , Tae Ho Kim , Il Sang Maeng , Song Hee Cho
- 申请人地址： KR Seoul
- 专利权人： LG INNOTEK CO., LTD.
- 当前专利权人： LG INNOTEK CO., LTD.
- 当前专利权人地址： KR Seoul
- 代理机构： Saliwanchik, Lloyd & Eisenschenk
- 优先权： KR10-2011-0056536 20110610
- 国际申请： PCT/KR2012/004607 WO 20120611
- 国际公布： WO2012/169866 WO 20121213
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K1/02 ; H05K1/18 ; H05K3/46
摘要：
Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.