Invention Grant
- Patent Title: Electrode structure
- Patent Title (中): 电极结构
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Application No.: US14598595Application Date: 2015-01-16
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Publication No.: US09320142B2Publication Date: 2016-04-19
- Inventor: Seung Min Baek , Yoon Su Kim , Jin Hyuck Yang , Chang Bae Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2014-0057291 20140513
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/40 ; H05K3/18
Abstract:
The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.
Public/Granted literature
- US20150334832A1 ELECTRODE STRUCTURE Public/Granted day:2015-11-19
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