Invention Grant
US09320171B2 Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux
有权
两相冷却系统,电力电子模块和扩展最大热通量的方法
- Patent Title: Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux
- Patent Title (中): 两相冷却系统,电力电子模块和扩展最大热通量的方法
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Application No.: US14297043Application Date: 2014-06-05
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Publication No.: US09320171B2Publication Date: 2016-04-19
- Inventor: Shailesh N. Joshi , Ercan M. Dede
- Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
- Applicant Address: US KY Erlanger
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US KY Erlanger
- Agency: Dinsmore & Shohl LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Two-phase cooling systems, power electronics modules, and methods for extending a maximum heat flux point of a two-phase cooling device are disclosed. In one embodiment, a method of operating a two-phase cooling device having an inlet, a chamber fluidly coupled to the inlet, and a heat transfer surface configured to receive heat flux from a heat generating device includes detecting at least one two-phase process parameter of the two-phase cooling device, and controlling a temperature of a coolant fluid at the inlet such that it is a first inlet temperature Tin1 when the at least one two-phase process parameter is less than a threshold. The method further includes controlling a temperature of the coolant fluid at the inlet such that it is a second inlet temperature Tin2, where Tin2 is less than Tin1.
Public/Granted literature
- US20150359133A1 TWO-PHASE COOLING SYSTEMS, POWER ELECTRONICS MODULES, AND METHODS FOR EXTENDING MAXIMUM HEAT FLUX Public/Granted day:2015-12-10
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