Invention Grant
US09321631B2 Method for embedding controlled-cavity MEMS package in integration board
有权
在集成板中嵌入控制腔MEMS封装的方法
- Patent Title: Method for embedding controlled-cavity MEMS package in integration board
- Patent Title (中): 在集成板中嵌入控制腔MEMS封装的方法
-
Application No.: US14490924Application Date: 2014-09-19
-
Publication No.: US09321631B2Publication Date: 2016-04-26
- Inventor: Christopher Daniel Manack , Frank Stepniak , Sreenivasan K. Koduri
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Frank D. Cimino
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00 ; G01J5/12 ; G01J5/04 ; H01L23/00
Abstract:
A method for fabricating a micro-electro-mechanical system (MEMS) provides a semiconductor chip having a cavity with a radiation sensor MEMS. The opening of the cavity at the chip surface is covered by a plate transmissive to the radiation sensed by the MEMS. A patterned metal film is placed across the plate surface remote from the cavity.
Public/Granted literature
- US20150004739A1 METHOD FOR EMBEDDING CONTROLLED-CAVITY MEMS PACKAGE IN INTEGRATION BOARD Public/Granted day:2015-01-01
Information query
