Invention Grant
- Patent Title: Copper substrate for deposition of graphene
- Patent Title (中): 用于沉积石墨烯的铜基底
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Application No.: US13817533Application Date: 2012-05-25
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Publication No.: US09322096B2Publication Date: 2016-04-26
- Inventor: Thomas A. Yager , Joshua Robinson
- Applicant: Thomas A. Yager , Joshua Robinson
- Applicant Address: US DE Wilmington
- Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee: EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Current Assignee Address: US DE Wilmington
- Agency: Turk IP Law, LLC
- International Application: PCT/US2012/039633 WO 20120525
- International Announcement: WO2013/176680 WO 20131128
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/26 ; C23C16/02 ; C23C16/54

Abstract:
Technologies are presented for growing graphene by chemical vapor deposition (CVD) on a high purity copper surface. The surface may be prepared by deposition of a high purity copper layer on a lower purity copper substrate using deposition processes such as sputtering, evaporation, electroplating, or CVD. The deposition of the high purity copper layer may be followed by a thermal treatment to facilitate grain growth. Use of the high purity copper layer in combination with the lower purity copper substrate may provide thermal expansion matching, compatibility with copper etch removal, or reduction of contamination, producing fewer graphene defects compared to direct deposition on a lower purity substrate at substantially less expense than deposition approaches using a high purity copper foil substrate.
Public/Granted literature
- US20130316167A1 COPPER SUBSTRATE FOR DEPOSITION OF GRAPHENE Public/Granted day:2013-11-28
Information query
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