Invention Grant
US09323972B2 Finger biometric sensor including stacked die each having a non-rectangular shape and related methods
有权
手指生物测定传感器包括各自具有非矩形形状的堆叠模具和相关方法
- Patent Title: Finger biometric sensor including stacked die each having a non-rectangular shape and related methods
- Patent Title (中): 手指生物测定传感器包括各自具有非矩形形状的堆叠模具和相关方法
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Application No.: US13943179Application Date: 2013-07-16
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Publication No.: US09323972B2Publication Date: 2016-04-26
- Inventor: Jean-Marie Bussat , Gordon S. Franza , Giovanni Gozzini
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: G06K9/00
- IPC: G06K9/00 ; H01L25/065 ; H01L25/00
Abstract:
A finger biometric sensor may include first and second integrated circuit (IC) dies arranged in a stacked relation. The first IC die may include a first semiconductor substrate and an array of finger biometric sensing pixels thereon, and the second IC die may include a second semiconductor substrate and processing circuitry thereon coupled to the array of finger biometric sensing pixels. The first and second IC dies may each have respective first and second non-rectangular shapes, such as circular shapes that are coextensive.
Public/Granted literature
- US20150023570A1 FINGER BIOMETRIC SENSOR INCLUDING STACKED DIE EACH HAVING A NON-RECTANGULAR SHAPE AND RELATED METHODS Public/Granted day:2015-01-22
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