Invention Grant
- Patent Title: Semiconductor package and fabrication method thereof
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US13922798Application Date: 2013-06-20
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Publication No.: US09324582B2Publication Date: 2016-04-26
- Inventor: Chun-Tang Lin , Yi-Che Lai
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW102108595A 20130312
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/52 ; H01L21/56 ; H01L21/48 ; H01L25/065 ; H01L23/498 ; H01L23/31
Abstract:
A fabrication method of a semiconductor package is disclosed, which includes the steps of: disposing a plurality of first semiconductor elements on an interposer; forming a first encapsulant on the interposer for encapsulating the first semiconductor elements; disposing a plurality of second semiconductor elements on the first semiconductor elements; forming a second encapsulant on the first semiconductor elements and the first encapsulant for encapsulating the second semiconductor elements; and thinning the interposer, thereby reducing the overall stack thickness and preventing warpage of the interposer.
Public/Granted literature
- US20140264928A1 SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2014-09-18
Information query
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