发明授权
- 专利标题: Three dimensional multilayer circuit
- 专利标题(中): 三维多层电路
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申请号: US13260019申请日: 2010-01-29
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公开(公告)号: US09324718B2公开(公告)日: 2016-04-26
- 发明人: Wei Wu , R. Stanley Williams
- 申请人: Wei Wu , R. Stanley Williams
- 申请人地址: US TX Houston
- 专利权人: Hewlett Packard Enterprise Development LP
- 当前专利权人: Hewlett Packard Enterprise Development LP
- 当前专利权人地址: US TX Houston
- 代理机构: Van Cott, Bagley, Cornwall & McCarthy
- 国际申请: PCT/US2010/022489 WO 20100129
- 国际公布: WO2011/093863 WO 20110804
- 主分类号: H01L25/00
- IPC分类号: H01L25/00 ; H03K19/177 ; H01L21/46 ; H01L21/4763 ; H01L27/10 ; H01L27/02 ; H01L27/06 ; H01L27/24
摘要:
A three dimensional multilayer circuit (600) includes a plurality of crossbar arrays (512) made up of intersecting crossbar segments (410, 420) and programmable crosspoint devices (514) interposed between the intersecting crossbar segments (410, 420). Shift pins (505, 510) are used to shift connection domains (430) of the intersecting crossbar segments (410, 420) between stacked crossbar arrays (512) such that the programmable crosspoint devices (514) are uniquely addressed. The shift pins (505, 510) make electrical connections between crossbar arrays (512) by passing vertically between crossbar segments (410, 510) in the first crossbar array (512) and crossbar segments in a second crossbar array. A method for transforming multilayer circuits is also described.
公开/授权文献
- US20120280282A1 Three Dimensional Multilayer Circuit 公开/授权日:2012-11-08
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