发明授权
US09325921B2 Method for manufacturing an imaging apparatus having a frame member covering a pad 有权
一种用于制造具有覆盖垫的框架构件的成像装置的方法

  • 专利标题: Method for manufacturing an imaging apparatus having a frame member covering a pad
  • 专利标题(中): 一种用于制造具有覆盖垫的框架构件的成像装置的方法
  • 申请号: US14677781
    申请日: 2015-04-02
  • 公开(公告)号: US09325921B2
    公开(公告)日: 2016-04-26
  • 发明人: Yasuhiro Kamada
  • 申请人: Sony Corporation
  • 申请人地址: JP Tokyo
  • 专利权人: Sony Corporation
  • 当前专利权人: Sony Corporation
  • 当前专利权人地址: JP Tokyo
  • 代理机构: Sheridan Ross P.C.
  • 优先权: JP2011-085328 20110407
  • 主分类号: H04N5/225
  • IPC分类号: H04N5/225 H04N5/369 H01L27/146
Method for manufacturing an imaging apparatus having a frame member covering a pad
摘要:
A solid-state imaging apparatus includes: a solid-state imaging device mounted on a substrate; a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate; a frame member that has a frame-like shape and surrounds side portions of the solid-state imaging device; and a light-transmissive optical member so accommodated in the frame member that the optical member faces an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion extending from the side where the optical member is present toward the imaging surface, and the frame member is integrally fixed to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion.
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