发明授权
- 专利标题: Method of manufacturing inductors for integrated circuit packages
- 专利标题(中): 制造集成电路封装的电感器的方法
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申请号: US13026470申请日: 2011-02-14
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公开(公告)号: US09330827B2公开(公告)日: 2016-05-03
- 发明人: Donald Gardner , Gerhard Schrom , Fabrice Paillet , Shamala Chickamenahalli
- 申请人: Donald Gardner , Gerhard Schrom , Fabrice Paillet , Shamala Chickamenahalli
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Trop Pruner & Hu, P.C.
- 主分类号: H01F17/00
- IPC分类号: H01F17/00 ; H01F41/04 ; H01F17/02 ; H01F27/28
摘要:
A process of making inductors for integrated circuit packages may involve forming an inductor upon a magnetic film on a package substrate. Conductors coupled either to a die or a voltage converter extend perpendicularly through the film to conductive plates, defining current paths through and across the film.
公开/授权文献
- US20110131797A1 Inductors for Integrated Circuit Packages 公开/授权日:2011-06-09
信息查询
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |