Invention Grant
US09331022B2 Substrate and patterning device for use in metrology, metrology method and device manufacturing method
有权
用于计量,计量方法和器件制造方法的基板和图案形成装置
- Patent Title: Substrate and patterning device for use in metrology, metrology method and device manufacturing method
- Patent Title (中): 用于计量,计量方法和器件制造方法的基板和图案形成装置
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Application No.: US14261879Application Date: 2014-04-25
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Publication No.: US09331022B2Publication Date: 2016-05-03
- Inventor: Maurits Van Der Schaar , Patrick Warnaar , Kaustuve Bhattacharyya , Hendrik Jan Hidde Smilde , Michael Kubis
- Applicant: ASML Netherlands B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L23/58
- IPC: H01L23/58 ; G03F9/00 ; H01L23/544 ; G03F7/20

Abstract:
A pattern from a patterning device is applied to a substrate by a lithographic apparatus. The applied pattern includes product features and metrology targets. The metrology targets include large targets and small targets which are for measuring overlay. Some of the smaller targets are distributed at locations between the larger targets, while other small targets are placed at the same locations as a large target. By comparing values measured using a small target and large target at the same location, parameter values measured using all the small targets can be corrected for better accuracy. The large targets can be located primarily within scribe lanes while the small targets are distributed within product areas.
Public/Granted literature
- US20140233031A1 Substrate and Patterning Device for Use in Metrology, Metrology Method and Device Manufacturing Method Public/Granted day:2014-08-21
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