Integrated circuit devices having a cavity and methods of manufacturing the integrated circuit devices are provided. The integrated circuit devices may include a pair of spacers, which define a recess. The integrated circuit device may also include a lower conductive pattern in the recess and an upper conductive pattern on the lower conductive pattern. The upper conductive pattern may have an etch selectivity with respect to the lower conductive pattern and may expose an upper surface of the lower conductive pattern adjacent a sidewall of the upper conductive pattern. An inner sidewall of one of the pair of spacers, the upper surface of the lower conductive pattern and the sidewall of the upper conductive pattern may define a space and a capping pattern may be formed on the upper conductive pattern to seal a top portion of the space, such that a cavity is disposed under the capping pattern.