Invention Grant
US09331176B2 Methods of forming field effect transistors, including forming source and drain regions in recesses of semiconductor fins
有权
形成场效应晶体管的方法,包括在半导体鳍片的凹槽中形成源区和漏区
- Patent Title: Methods of forming field effect transistors, including forming source and drain regions in recesses of semiconductor fins
- Patent Title (中): 形成场效应晶体管的方法,包括在半导体鳍片的凹槽中形成源区和漏区
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Application No.: US13870471Application Date: 2013-04-25
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Publication No.: US09331176B2Publication Date: 2016-05-03
- Inventor: Mark S. Rodder , Dong-Won Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66

Abstract:
Methods of forming a fin-shaped Field Effect Transistor (FinFET) are provided. The methods may include selectively incorporating source/drain extension-region dopants into source and drain regions of a semiconductor fin, using a mask to block incorporation of the source/drain extension-region dopants into at least portions of the semiconductor fin. The methods may include removing portions of the source and drain regions of the semiconductor fin to define recesses therein. The methods may include epitaxially growing source and drain regions from the recesses in the semiconductor fin.
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