Invention Grant
- Patent Title: Mobile device and manufacturing method thereof
- Patent Title (中): 移动设备及其制造方法
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Application No.: US13442644Application Date: 2012-04-09
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Publication No.: US09331379B2Publication Date: 2016-05-03
- Inventor: Chien-Pin Chiu , Hsiao-Wei Wu , Tiao-Hsing Tsai , Ying-Chih Wang
- Applicant: Chien-Pin Chiu , Hsiao-Wei Wu , Tiao-Hsing Tsai , Ying-Chih Wang
- Applicant Address: TW Taoyuan
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/38 ; H01Q1/06 ; H01Q13/10 ; H01Q9/42 ; H01Q5/371
Abstract:
A mobile device includes a substrate, a ground element, and a radiation branch. The ground element includes a ground branch, wherein an edge of the ground element has a notch extending into the interior of the ground element so as to form a slot region, and the ground branch partially surrounds the slot region. The radiation branch is substantially inside the slot region, and is coupled to the ground branch of the ground element. The ground branch and the radiation branch form an antenna structure.
Public/Granted literature
- US20130207846A1 MOBILE DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-08-15
Information query
