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发明授权
US09332646B2 Electronic package module and method of manufacturing the same 有权
电子封装模块及其制造方法

Electronic package module and method of manufacturing the same
摘要：
An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.
摘要（中）：

电子封装模块包括具有支撑表面的电路板，至少一个第一电子部件，至少一个第二电子部件和至少一个模制化合物。 第一和第二电子部件安装在支撑表面上。 模制化合物设置在支撑表面上并且部分地覆盖支撑表面。 模制化合物封装第一电子部件而不是第二电子部件。

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