Invention Grant
US09337111B2 Apparatus and method to attach a wireless communication device into a semiconductor package
有权
将无线通信设备附接到半导体封装中的装置和方法
- Patent Title: Apparatus and method to attach a wireless communication device into a semiconductor package
- Patent Title (中): 将无线通信设备附接到半导体封装中的装置和方法
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Application No.: US13853496Application Date: 2013-03-29
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Publication No.: US09337111B2Publication Date: 2016-05-10
- Inventor: Yohanes Bintang
- Applicant: STMicroelectronics Pte Ltd.
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd
- Current Assignee: STMicroelectronics Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/66 ; H01L23/31

Abstract:
A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database.
Public/Granted literature
- US20140291867A1 APPARATUS AND METHOD TO ATTACH A WIRELESS COMMUNICATION DEVICE INTO A SEMICONDUCTOR PACKAGE Public/Granted day:2014-10-02
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