A chip package is provided. The chip package includes a substrate having a first surface and a second surface opposite thereto. The substrate includes a sensing device and a conducting pad therein. The sensing device and the conducting pad are adjacent to the first surface. The conducting pad has a sidewall laterally protruding from a sidewall of the substrate. An encapsulation layer is attached to the first surface of the substrate to cover the sensing device and the conducting pad. A redistribution layer is disposed on the second surface of the substrate and extends to contact the sidewall of the conducting pad. An end of the redistribution layer protrudes from the first surface of the substrate and is level with a third surface of the encapsulation layer that is opposite to the first surface. A method of forming the chip package is also provided.