Invention Grant
- Patent Title: Through-hole layout structure including first and second pairs of differential signal through-holes disposed between three ground through-holes
- Patent Title (中): 通孔布局结构包括设置在三个通孔之间的第一对和第二对差分信号通孔
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Application No.: US14534170Application Date: 2014-11-06
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Publication No.: US09338879B2Publication Date: 2016-05-10
- Inventor: Sheng-Yuan Lee
- Applicant: VIA Technologies, Inc.
- Applicant Address: TW New Taipei
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW103131781A 20140915
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11
Abstract:
A through-hole layout structure is suitable for a circuit board. The through-hole layout structure includes a pair of first differential through-holes, a pair of second differential through-holes, a first ground through-hole, a second ground through-hole, and a third ground through-hole, which are all arranged on a first line. The first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes. The pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole. The pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole.
Public/Granted literature
- US20160021735A1 THROUGH-HOLE LAYOUT STRUCTURE, CIRCUIT BOARD, AND ELECTRONIC ASSEMBLY Public/Granted day:2016-01-21
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