Invention Grant
- Patent Title: High-performance structured packing for a fluid contacting column
- Patent Title (中): 用于流体接触塔的高性能规整填料
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Application No.: US14426405Application Date: 2013-08-12
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Publication No.: US09339786B2Publication Date: 2016-05-17
- Inventor: Ludovic Raynal , Raphael Gonnot , Mickael Mejean
- Applicant: IFP Energies nouvelles
- Applicant Address: FR Rueil-Malmaison
- Assignee: IFP Energies nouvelles
- Current Assignee: IFP Energies nouvelles
- Current Assignee Address: FR Rueil-Malmaison
- Agency: Fitch, Even, Tabin & Flannery LLP
- Priority: FR1202421 20120911
- International Application: PCT/FR2013/051927 WO 20130812
- International Announcement: WO2014/041270 WO 20140320
- Main IPC: B01J19/32
- IPC: B01J19/32

Abstract:
The packing includes a pile of plates having corrugations forming a succession of positive and negative edges, each edge comprising fins, each fin being made up of at least one band cut out in one of the plates and remaining secured to the plate on at least one side, the band being deformed so as to create an orifice forming a discontinuity on the surface of the plate, wherein the direction of the edges of a plate forms a non-zero angle with respect to the direction of the edges of an adjacent plate. Each plate has at least one longitudinal zone parallel to one lip of the plate where the edges have no orifice, the zones being positioned in such a way that two adjacent plates have their zone one above the other so as to form at least one point of contact between a positive edge and a negative edge of the two adjacent plates.
Public/Granted literature
- US20150231597A1 HIGH-PERFORMANCE STRUCTURED PACKING FOR A FLUID CONTACTING COLUMN Public/Granted day:2015-08-20
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