Invention Grant
- Patent Title: Thermal conduction system
- Patent Title (中): 导热系统
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Application No.: US14661375Application Date: 2015-03-18
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Publication No.: US09341794B1Publication Date: 2016-05-17
- Inventor: George Edward Curtis , Keith Frank Tharp , Gary King Chan
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Merchant & Gould P.C.
- Main IPC: G02B6/00
- IPC: G02B6/00 ; G02B6/42 ; H01R13/66 ; G02B6/38
Abstract:
A cage within a communication module may have a plurality of receptacles. A cover may cover at least a portion of the cage. A thermal conduction system may include a top wrap, a first side wrap, and a second side wrap. The top wrap may comprise a top wrap top portion covering at least a portion of the cover top side and a top wrap back portion covering at least a portion of the cover back side. The first side wrap may comprise a first side wrap back portion covering at least a portion of the top wrap back portion, a first side wrap side portion covering at least a portion of the cover first side, and first side fingers extending through a first slit in the cover into the cage. A heat sink may be attached to the first side wrap back portion.
Information query
